Course Description
This course provides a comprehensive introduction to CMOS semiconductor fabrication, covering the evolution of transistors and the core processes behind integrated circuit manufacturing. It offers a practical understanding of cleanroom environments, contamination control, wet processing techniques, diffusion, oxidation, and ion implantation with post-processing annealing. A key strength of this course lies in its integration of theoretical models with real-world applications, helping learners see how fabrication steps translate into functional semiconductor devices. By addressing both the scientific principles and the practical workflows used in fabrication facilities, this course prepares participants to better understand and engage with modern semiconductor manufacturing environments.
What you'll learn
After completing this course you will be able to :
• Outline the main stages of CMOS fabrication and explain the role of each in transistor development.
• Classify cleanroom types and describe methods for managing particulate and chemical contamination.
• Analyze diffusion and oxidation processes using key mathematical models such as Fick’s Law and the Deal-Grove Model.
• Explain ion implantation techniques and assess their impact on silicon lattice structures and how annealing processes restore them.
• Connect theoretical fabrication concepts to industrial applications, evaluating how process decisions influence chip quality and performance.
Requirements
• Basic knowledge of electronics (understanding of semiconductors, diodes, and transistors).
• Fundamentals of physics and chemistry (particularly solid-state physics and chemical reactions).
• Basic understanding of mathematics (algebra and introductory differential equations for process modeling).
